Introduction to Floor Polishing Pads

The material composition of floor grinding pads (also referred to as polishing pads or sanding pads) varies depending on their intended application and the specific stage of the processing workflow.

Polishing pads-also known as CMP pads or chemical-mechanical planarization pads-serve as a core consumable in the Chemical-Mechanical Polishing (CMP) process. They are primarily utilized for the surface planarization of substrates such as semiconductor wafers. Typically fabricated from materials such as polyurethane, these pads are broadly categorized-based on their composition-into types including polyurethane, non-woven fabrics, natural materials, and composite materials. Historically, this market has been heavily monopolized by foreign enterprises; within the domestic market, Dinglong Co., Ltd. stands as a representative enterprise in this sector.

Their core function during the polishing process involves delivering the polishing slurry, transmitting pressure, and exerting mechanical friction upon the wafer surface.

Polishing pads typically feature a porous microstructure, with specific groove patterns designed into their surfaces to enhance polishing uniformity.

Key performance parameters-such as hardness and groove patterns-are critical attributes of polishing pads, as they directly influence both the material removal rate and the final surface finish.